Semiconductor Memory Having Both Volatile and Non-Volatile Functionality and Method of Operating

ABSTRACT

Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor storage device includes a plurality of memory cells each having a floating body for storing, reading and writing data as volatile memory. The device includes a floating gate or trapping layer for storing data as non-volatile memory, the device operating as volatile memory when power is applied to the device, and the device storing data from the volatile memory as non-volatile memory when power to the device is interrupted.

CROSS-REFERENCE

This application claims the benefit of U.S. Provisional Application No.60/982,382, filed on Oct. 24, 2007 and also claims the benefit of U.S.Provisional Application No. 60/982,374, filed on Oct. 24, 2007. BothApplications (60/982,382 and 60/982,374) are hereby incorporated herein,in their entireties, by reference thereto.

This application also hereby incorporates International Application No.PCT/US2007/024544 in its entirety, by reference thereto.

FIELD OF THE INVENTION

The present inventions relates to semiconductor memory technology. Morespecifically, the present invention relates to semiconductor memoryhaving both volatile and non-volatile semiconductor memory features.

BACKGROUND OF THE INVENTION

Semiconductor memory devices are used extensively to store data. Memorydevices can be characterized according to two general types: volatileand non-volatile. Volatile memory devices such as static random accessmemory (SRAM) and dynamic random access memory (DRAM) lose data that isstored therein when power is not continuously supplied thereto.

Non-volatile memory devices, such as flash erasable programmable readonly memory (Flash EPROM) device, retain stored data even in the absenceof power supplied thereto. Unfortunately, non-volatile memory devicestypically operate more slowly than volatile memory devices. Accordingly,it would be desirable to provide a universal type memory device thatincludes the advantages of both volatile and non-volatile memorydevices, i.e., fast operation on par with volatile memories, whilehaving the ability to retain stored data when power is discontinued tothe memory device. It would further be desirable to provide such auniversal type memory device having a size that is not prohibitivelylarger than comparable volatile or non-volatile devices.

SUMMARY OF THE INVENTION

The present invention provides semiconductor memory having both volatileand non-volatile modes and methods of operation of the same.

in at least one embodiment, a method of operating a semiconductorstorage device comprising a plurality of memory cells each having afloating body for storing, reading and writing data as volatile memory,and a floating gate or trapping layer for storing data as non-volatilememory is provided, including: reading and storing data to the floatingbodies as volatile memory while power is applied to the device;transferring the data stored in the floating bodies, by a parallel,non-algorithmic process, to the floating gates or trapping layerscorresponding to the floating bodies, when power to the device isinterrupted; and storing the data in the floating gates or trappinglayers as non-volatile memory.

In at least one embodiment, the method includes: transferring the datastored in the floating gates or trapping layers, by a parallel,non-algorithmic restore process, to the floating bodies corresponding tothe floating gates or trapping layers, when power is restored to thecell: and storing the data in the floating bodies as volatile memory.

In at least one embodiment, the method includes initializing thefloating gates or trapping layers, to each have the same predeterminedstate prior to the transferring.

In at least one embodiment, the predetermined state comprises a positivecharge.

In at least one embodiment, the data transferred is stored in thefloating gates or trapping layers with charges that are complementary tocharges of the floating bodies when storing the data.

In at least one embodiment, the method includes restoring the floatinggates or trapping layers to a predetermined charge state after therestore process.

In at least one embodiment, the method includes writing a predeterminedstate to the floating bodies prior to the transferring the data storedin the floating gates or trapping layers to the floating bodies.

In at least one embodiment, the predetermined state is state “0”.

A semiconductor storage device that includes a plurality of memory cellsis provided, wherein each memory cell has a floating body for storing,reading and writing data as volatile memory, and a floating gate ortrapping layer for storing data as non-volatile memory, the deviceoperating as volatile memory when power is applied to the device, andthe device storing data from the volatile memory as non-volatile memorywhen power to the device is interrupted.

In at least one embodiment, data is transferred from the volatile memoryto the non-volatile memory by a parallel, non-algorithmic mechanism.

In at least one embodiment, the device is configured to transfer datastored in non-volatile memory to store the data in the volatile memorywhen power is restored to the device.

in at least one embodiment, the data is transferred from thenon-volatile memory to the volatile memory by a parallel,non-algorithmic mechanism.

In at least one embodiment, the memory cells function as multi-levelcells.

A memory string comprising a plurality of semiconductor memory cellsconnected in series is provided, each semiconductor memory cellcomprising: a floating substrate region having a first conductivitytype; first and second regions each having a second conductivity typeand interfacing with the floating substrate region, such that at least aportion of the floating substrate region is located between the firstand second regions and functions to store data in volatile memory; afloating gate or trapping layer positioned in between the first andsecond regions, adjacent a surface of the floating substrate region andinsulated from the floating substrate region by an insulating layer: thefloating gate or trapping layer being configured to receive transfer ofdata stored by the volatile memory and store the data as nonvolatilememory in the floating gate or trapping layer upon interruption of powerto the memory cell; a control gate positioned adjacent the floating gateor trapping layer: and a second insulating layer between the floatinggate or trapping layer and the control gate.

In at least one embodiment, the semiconductor memory cells aresubstantially planar.

In at least one embodiment, the semiconductor memory cells comprisethree-dimensional cells, each having a fin extending from a substrate.

In at least one embodiment, a string selection transistor is connectedto one end of the plurality of semiconductor memory cells connected inseries, and a ground selection transistor is connected to an oppositeend the plurality of semiconductor memory cells connected in series.

In at least one embodiment, the semiconductor memory cells function asmulti-level cells.

A memory cell device including a plurality of memory strings assembledto form a grid of semiconductor memory cells is provided, each of thememory strings comprising a plurality of semiconductor memory cellsconnected in series, each semiconductor memory cell comprising: afloating substrate region having a first conductivity type; first andsecond regions each having a second conductivity type and interfacingwith said floating substrate region, such that at least a portion of thefloating substrate region is located between the first and secondregions and functions to store data in volatile memory; a floating gateor trapping layer positioned in between the first and second regions,adjacent a surface of the floating substrate region and insulated fromthe floating substrate region by an insulating layer; the floating gateor trapping layer being configured to receive transfer of data stored bythe volatile memory and store the data as nonvolatile memory in thefloating gate or trapping layer upon interruption of power to the memorycell: a control gate positioned adjacent the floating gate or trappinglayer; and a second insulating layer between the floating gate ortrapping layer and the control gate.

In at least one embodiment, the memory strings form columns of the grid.

In at least one embodiment, the columns are insulated from one anotherby insulating members placed between the columns.

In at least one embodiment, the semiconductor memory cells function asmulti-level cells.

These and other features of the invention will become apparent to thosepersons skilled in the art upon reading the details of the devices andmethods as more fully described below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart illustrating operation of a non-volatile memorydevice according to the present invention.

FIG. 2 schematically illustrates an embodiment of a memory cellaccording to the present invention.

FIGS. 3A-3B illustrate alternative write state “1” operations that canbe carried out on a memory cell according to the present invention.

FIG. 4 illustrates a write state “0” operation that can be carried outon a memory cell according to the present invention.

FIG. 5 illustrates a read operation that can be carried out on a memorycell according to the present invention.

FIGS. 6A and 6B illustrate shadowing operations according to the presentinvention.

FIGS. 7A and 7B illustrate restore operations according to the presentinvention.

FIGS. 8A-8D illustrate another embodiment of operation of a memory cellto perform volatile to non-volatile shadowing according to the presentinvention.

FIG. 8E illustrates the operation of an NPN bipolar device.

FIGS. 9A-9B illustrate another embodiment of operation of a memory cellto perform a restore process from non-volatile to volatile memoryaccording to the present invention.

FIG. 10 illustrates resetting the floating gate(s)/trapping layer(s) toa predetermined state.

FIG. 11A illustrates the states of a binary cell, relative to thresholdvoltage.

FIG. 11B illustrates the states of a multi-level cell, relative tothreshold voltage.

FIG. 12 illustrates a fin-type semiconductor memory cell deviceaccording to an embodiment of the present invention.

FIG. 13 is a schematic illustration of a top view of the cell of FIG.12.

FIGS. 14A and 14B are referenced to illustrate write “1” operations onthe device of FIG. 12.

FIG. 15 is referenced to illustrate a write “0” operation on the deviceof FIG. 12.

FIG. 16 is referenced to illustrate a read operation on the device ofFIG. 12.

FIGS. 17A and 17B illustrate a shadowing operation on the device of FIG.12.

FIG. 18 is referenced to illustrate a restore operation on the device ofFIG. 12.

FIG. 19 is referenced to illustrate a reset operation on the device ofFIG. 12.

FIG. 20 is a cross-sectional schematic illustration of a memory stringaccording to an embodiment of the present invention.

FIG. 21 illustrates a top schematic view of the string of FIG. 20.

FIGS. 22A and 22B illustrate alternative write state “1” operations thatcan be carried out on the string of FIG. 20.

FIG. 23 illustrates a write state “0” operation on the string of FIG.20.

FIG. 24 illustrates a read operation on the string of FIG. 20.

FIGS. 25A-25B illustrate a shadowing operation on the string of FIG. 20.

FIG. 26 illustrates a restore operation on the string of FIG. 20.

FIG. 27 illustrates a reset operation on the string of FIG. 20.

DETAILED DESCRIPTION OF THE INVENTION

Before the present devices and methods are described, it is to beunderstood that this invention is not limited to particular embodimentsdescribed, as such may, of course, vary. It is also to be understoodthat the terminology used herein is for the purpose of describingparticular embodiments only, and is not intended to be limiting, sincethe scope of the present invention will be limited only by the appendedclaims.

Where a range of values is provided, it is understood that eachintervening value, to the tenth of the unit of the lower limit unlessthe context clearly dictates otherwise, between the upper and lowerlimits of that range is also specifically disclosed. Each smaller rangebetween any stated value or intervening value in a stated range and anyother stated or intervening value in that stated range is encompassedwithin the invention. The upper and lower limits of these smaller rangesmay independently be included or excluded in the range, and each rangewhere either, neither or both limits are included in the smaller rangesis also encompassed within the invention, subject to any specificallyexcluded limit in the stated range. Where the stated range includes oneor both of the limits, ranges excluding either or both of those includedlimits are also included in the invention.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this invention belongs. Although any methods andmaterials similar or equivalent to those described herein can be used inthe practice or testing of the present invention, the preferred methodsand materials are now described. All publications mentioned herein areincorporated herein by reference to disclose and describe the methodsand/or materials in connection with which the publications are cited.

It must be noted that as used herein and in the appended claims, thesingular forms “a”, “an”, and “the” include plural referents unless thecontext clearly dictates otherwise. Thus, for example, reference to “adevice” includes a plurality of such devices and reference to “thetransistor” includes reference to one or more transistors andequivalents thereof known to those skilled in the art, and so forth.

The publications discussed herein are provided solely for theirdisclosure prior to the filing date of the present application. Nothingherein is to be construed as an admission that the present invention isnot entitled to antedate such publication by virtue of prior invention.Further, the dates of publication provided may be different from theactual publication dates which may need to be independently confirmed.

DEFINITIONS

The terms “shadowing” “shadowing operation” and “shadowing process”refer to a process of copying the content of volatile memory tonon-volatile memory.

“Restore”, “restore operation”, or “restore process”, as used herein,refers to a process of copying the content of non-volatile memory tovolatile memory.

“Reset”, “reset operation”, or “reset process”, as used herein, refersto a process of setting non-volatile memory to a predetermined statefollowing a restore process, or when otherwise setting the non-volatilememory to an initial state (such as when powering up for the first time,prior to ever storing data in the non-volatile memory, for example).

FIG. 1 is a flowchart 100 illustrating operation of a memory deviceaccording to the present invention. At event 102, when power is firstapplied to the memory device, the memory device is placed in an initialstate, in a volatile operational mode and the nonvolatile memory is setto a predetermined state, typically set to have a positive charge. Atevent 104 the memory device of the present invention operates in thesame manner as a conventional DRAM memory cell, i.e., operating asvolatile memory. However, during power shutdown, or when power isinadvertently lost, or any other event that discontinues or upsets powerto the memory device of the present invention, the content of thevolatile memory is loaded into non-volatile memory at event 106, duringa process which is referred to here as “shadowing” (event 106), and thedata held in volatile memory is lost. Shadowing can also be performedduring backup operations, which may be performed at regular intervalsduring DRAM operation 104 periods, and/or at any time that a usermanually instructs a backup. During a backup operation, the content ofthe volatile memory is copied to the non-volatile memory while power ismaintained to the volatile memory so that the content of the volatilememory also remains in volatile memory. Alternatively, because thevolatile memory operation consumes more power than the non-volatilestorage of the contents of the volatile memory, the device can beconfigured to perform the shadowing process anytime the device has beenidle for at least a predetermined period of time, thereby transferringthe contents of the volatile memory into non-volatile memory andconserving power. As one example, the predetermined time period can beabout thirty minutes, but of course, the invention is not limited tothis time period, as the device could be programmed with virtually anypredetermined time period.

After the content of the volatile memory has been moved during ashadowing operation to nonvolatile memory, the shutdown of the memorydevice occurs, as power is no longer supplied to the volatile memory. Atthis time, the memory device functions like a Flash EPROM device in thatit retains the stored data in the nonvolatile memory. Upon restoringpower at event 108, the content of the nonvolatile memory is restored bytransferring the content of the non-volatile memory to the volatilememory in a process referred to herein as the “restore” process, afterwhich, upon resetting the memory device at event 110, the memory deviceis again set to the initial state (event 102) and again operates in avolatile mode, like a DRAM memory device, event 104.

The present invention thus provides a memory device which combines thefast operation of volatile memories with the ability to retain chargethat is provided in nonvolatile memories. Further, the data transferfrom the volatile mode to the non-volatile mode and vice versa, operatein parallel by a non-algorithmic process described below, which greatlyenhances the speed of operation of the storage device. As onenon-limiting practical application of use of a memory device accordingto the present invention, a description of operation of the memorydevice in a personal computer follows. This example is in no wayintended to limit the applications in which the present invention may beused, as there are many applications, including, but not limited to:cell phones, laptop computers, desktop computers, kitchen appliances,land line phones, electronic gaming, video games, personal organizers.mp3 and other electronic forms of digital music players, and any otherapplications, too numerous to mention here, that use digital memory. Inuse, the volatile mode provides a fast access speed and is what is usedduring normal operations (i.e., when the power is on to the memorydevice). In an example of use in a personal computer (PC), when thepower to the PC is on (i.e., the PC is turned on), the memory deviceaccording to the present invention operates in volatile mode. When thePC is shut down (i.e., power is turned off), the memory content of thevolatile memory is shadowed to the non-volatile memory of the memorydevice according to the present invention. When the PC is turned onagain (power is turned on), the memory content is restored from thenon-volatile memory to the volatile memory. A reset process is thenconducted on the non-volatile memory so that its data does not interferewith the data having been transferred to the volatile memory.

FIG. 2 schematically illustrates an embodiment of a memory cell 50according to the present invention. The cell 50 includes a substrate 12of a first conductivity type, such as a p-type conductivity type, forexample. Substrate 12 is typically made of silicon, but may comprisegermanium, silicon germanium, gallium arsenide, carbon nanotubes, orother semiconductor materials known in the art. The substrate 12 has asurface 14. A first region 16 having a second conductivity type, such asn-type, for example, is provided in substrate 12 and which is exposed atsurface 14. A second region 18 having the second conductivity type isalso provided in substrate 12, which is exposed at surface 14 and whichis spaced apart from the first region 16. First and second regions 16and 18 are formed by an implantation process formed on the materialmaking up substrate 12, according to any of implantation processes knownand typically used in the art.

A buried layer 22 of the second conductivity type is also provided inthe substrate 12, buried in the substrate 12, as shown. Region 22 isalso formed by an ion implantation process on the material of substrate12. A body region 24 of the substrate 12 is bounded by surface 14, firstand second regions 16, 18 and insulating layers 26 (e.g. shallow trenchisolation (STI)), which may be made of silicon oxide, for example.Insulating layers 26 insulate cell 50 from neighboring cells 50 whenmultiple cells 50 are joined to make a memory device. A floating gate ortrapping layer 60 is positioned in between the regions 16 and 18, andabove the surface 14. Trapping layer/floating gate 60 is insulated fromsurface 14 by an insulating layer 62. Insulating layer 62 may be made ofsilicon oxide and/or other dielectric materials, including high “K”dielectric materials, such as, but not limited to, tantalum peroxide,titanium oxide, zirconium oxide, hafnium oxide, and/or aluminum oxide.Floating gate/trapping layer 60 may be made of polysilicon material. Ifa trapping layer is chosen, the trapping layer may be made from siliconnitride or silicon nanocrystal, etc. Whether a floating gate 60 or atrapping layer 60 is used, the function is the same, in that they holddata in the absence of power. The primary difference between thefloating gate 60 and the trapping layer 60 is that the floating gate 60is a conductor, while the trapping layer 60 is an insulator layer. Thus,typically one or the other of trapping layer 60 and floating gate 60 areemployed in device 50, but not both.

A control gate 66 is positioned above floating gate/trapping layer 60and insulated therefrom by insulating layer 64 such that floatinggate/trapping layer 60 is positioned between insulating layer 62 andsurface 14 underlying floating gate/trapping layer 60, and insulatinglayer 64 and control gate 66 positioned above floating gate/trappinglayer 60, as shown. Control gate 66 is capacitively coupled to floatinggate/trapping layer 60. Control gate 66 is typically made of polysiliconmaterial or metal gate electrode, such as tungsten, tantalum, titaniumand their nitrides. The relationship between the floating gate/trappinglayer 60 and control gate 66 is similar to that of a nonvolatile stackedgate floating gate/trapping layer memory cell. The floatinggate/trapping layer 60 functions to store non-volatile memory data andthe control gate 66 is used for memory cell selection.

Cell 50 includes four terminals: word line (WL) terminal 70, source line(SL) terminal 72, bit line (BL) terminal 74 and buried well (BW)terminal 76. Terminal 70 is connected to control gate 66. Terminal 72 isconnected to first region 16 and terminal 74 is connected to secondregion 18. Alternatively, terminal 72 can be connected to second region18 and terminal 74 can be connected to first region 16. Terminal 76 isconnected to buried layer 22.

When power is applied to cell 50, cell 50 operates like a currentlyavailable capacitorless DRAM cell. In a capacitorless DRAM device, thememory information (i.e., data that is stored in memory) is stored ascharge in the floating body of the transistor, i.e., in the body 24 ofcell 50. The presence of the electrical charge in the floating body 24modulates the threshold voltage of the cell 50, which determines thestate of the cell 50.

FIGS. 3A-3B illustrate alternative write state “1” operations that canbe carried out on cell 50, by performing band-to-band tunneling hot holeinjection (FIG. 3A) or impact ionization hot hole injection (FIG. 3B).In alternative embodiments, electrons can be transferred, rather thanholes. In FIG. 3A, to write a state “1” into the floating body region24, a substantially neutral voltage is applied to SL terminal 72, apositive voltage is applied to BL terminal 74, a negative voltage isapplied to WL terminal 70 and a positive voltage less than the positivevoltage applied to the BL terminal 74 is applied to BW terminal 76.Under these conditions, holes are injected from BL terminal 76 into thefloating body region 24, leaving the body region 24 positively charged.In one particular non-limiting embodiment, a charge of about 0.0 voltsis applied to terminal 72, a charge of about +2.0 volts is applied toterminal 74, a charge of about −1.2 volts is applied to terminal 70, anda charge of about +0.6 volts is applied to terminal 76. However, thesevoltage levels may vary, while maintaining the relative relationshipsbetween the charges applied, as described above. For example, voltageapplied to terminal 72 may be in the range of about 0.0 volts to about+0.4 volts, voltage applied to terminal 74 may be in the range of about+1.5 volts to about +3.0 volts, voltage applied to terminal 70 may be inthe range of about 0.0 volts to about −3.0 volts, and voltage applied toterminal 76 may be in the range of about 0.0 volts to about +1.0 volts.Further, the voltages applied to terminals 72 and 74 may be reversed,and still obtain the same result, e.g., a positive voltage applied toterminal 72 and a neutral charge applied to terminal 74.

Alternatively, as illustrated in FIG. 3B, to write a state “1” into thefloating body region 24, a substantially neutral voltage is applied toSL terminal 72, a positive voltage is applied to BL terminal 74, apositive voltage less positive than the positive voltage applied toterminal 72 is applied to WL terminal 70 and a positive voltage lesspositive than the positive voltage applied to terminal 74 is applied toBW terminal 76. Under these conditions, holes are injected from BLterminal 74 into the floating body region 24, leaving the body region 24positively charged. In one particular non-limiting embodiment, about 0.0volts is applied to terminal 72, about +2.0 volts is applied to terminal74, about +1.2 volts is applied to terminal 70, and about +0.6 volts isapplied to terminal 76. However, these voltage levels may vary, whilemaintaining the relative relationships between the charges applied, asdescribed above. For example, voltage applied to terminal 72 may be inthe range of about 0.0 volts to about +0.6 volts, voltage applied toterminal 74 may be in the range of about +1.5 volts to about +3.0 volts,voltage applied to terminal 70 may be in the range of about 0.0 volts toabout +1.6 volts, and voltage applied to terminal 76 may be in the rangeof about 0.0 volts to about 1.0 volts. Further, the voltages applied toterminals 72 and 74 may be reversed, and still obtain the same result,e.g., a positive voltage applied to terminal 72 and a neutral chargeapplied to terminal 74.

FIG. 4 illustrates a write state “0.” operation that can be carried outon cell 50. To write a state “0” into floating body region 24, anegative voltage is applied to SL terminal 72, a substantially neutralvoltage is applied to BL terminal 74, a negative voltage less negativethan the negative voltage applied to terminal 72 is applied to WLterminal 70 and a positive voltage is applied to BW terminal 76. Underthese conditions, the p-n junction (junction between 24 and 16 andbetween 24 and 18) is forward-biased, evacuating any holes from thefloating body 24. In one particular non-limiting embodiment, about −2.0volts is applied to terminal 72, about 0.0 volts is applied to terminal74, about −1.2 volts is applied to terminal 70, and about +0.6 volts isapplied to terminal 76. However, these voltage levels may vary, whilemaintaining the relative relationships between the charges applied, asdescribed above. For example, voltage applied to terminal 72 may be inthe range of about −1.0 volts to about −3.0 volts, voltage applied toterminal 74 may be in the range of about −1.0 volts to about −3.0 volts,voltage applied to terminal 70 may be in the range of about 0.0 volts toabout −3.0 volts, and voltage applied to terminal 76 may be in the rangeof about 0.0 volts to about 1.0 volts. Further, the voltages applied toterminals 72 and 74 may be reversed, and still obtain the same result,e.g., a substantially neutral voltage applied to terminal 72 and anegative charge applied to terminal 74.

A read operation of the cell 50 is now described with reference to FIG.5. To read cell 50, a substantially neutral charge volts is applied toSL terminal 72, a positive voltage is applied to BL terminal 74, apositive voltage that is more positive than the positive voltage appliedto terminal 74 is applied to WL terminal 70 and a positive voltage thatis less than the positive voltage applied to terminal 70 is applied toBW terminal 76. If cell 50 is in a state “1” having holes in the bodyregion 24, then a lower threshold voltage (gate voltage where thetransistor is turned on) is observed compared to the threshold voltageobserved when cell 50 is in a state “0” having no holes in body region24. In one particular non-limiting embodiment, about 0.0 volts isapplied to terminal 72, about +0.4 volts is applied to terminal 74,about +1.2 volts is applied to terminal 70, and about +0.6 volts isapplied to terminal 76. However, these voltage levels may vary, whilemaintaining the relative relationships between the charges applied, asdescribed above. For example, terminal 72 is grounded and is thus atabout 0.0 volts, voltage applied to terminal 74 may be in the range ofabout +0.1 volts to about +1.0 volts, voltage applied to terminal 70 maybe in the range of about +1.0 volts to about +3.0 volts, and voltageapplied to terminal 76 may be in the range of about 0.0 volts to about1.0 volts. Further, the voltages applied to terminals 72 and 74 may bereversed, and still obtain the same result. e.g., a positive voltageapplied to terminal 72 and a neutral charge applied to terminal 74.

When power down is detected, e.g. when a user turns off the power tocell 50, or the power is inadvertently interrupted, or for any otherreason, power is at least temporarily discontinued to cell 50, datastored in the floating body region 24 is transferred to floatinggate/trapping layer 60. This operation is referred to as “shadowing” andis described with reference to FIGS. 6A and 6B. To perform the shadowingoperation, both SL terminal 72 and BL terminal 74 are left floating(i.e., not held to any specific voltage, but allowed to float to theirrespective voltages). A high positive voltage (e.g., about +18 volts) isapplied to WL terminal 70 and a low positive voltage (e.g., about +0.6volts) is applied to BW terminal 76. If cell 50 is in a state “1” asillustrated in FIG. 6A, thus having holes in body region 24, a lowerelectric field between the floating gate/trapping layer 60 and thefloating body region 24 is observed in comparison to the electric fieldobserved between the floating gate/trapping layer 60 and the floatingbody region 24 when cell 50 is in a state “0” as illustrated in FIG. 6B.

The high electric field between the floating gate/trapping layer region60 and the floating body region 24, when floating body 24 is at state“0” causes electrons to tunnel from floating body 24 to floatinggate/trapping layer 60 and the floating gate/trapping layer 60 thusbecomes negatively charged. Conversely, the relatively lower electricfield existent between the floating gate/trapping layer region 60 andfloating body 24 when cell 50 is in the state “1” is not sufficient tocause electron tunneling from the floating body 24 to floatinggate/trapping layer 60 and therefore floating gate/trapping layer 60does not become negatively charged in this situation.

In one particular non-limiting embodiment, terminals 72 and 74 areallowed to float, about +18 volts is applied to terminal 70, and about+0.6 volts is applied to terminal 76. However, these voltage levels mayvary, while maintaining the relative relationships between the chargesapplied, as described above. For example, voltage applied to terminal 70may be in the range of about +12.0 volts to about +20.0 volts, andvoltage applied to terminal 76 may be in the range of about 0.0 volts toabout 1.0 volts.

When power is restored to cell 50, the state of the cell 50 as stored onfloating gate/trapping layer 60 is restored into floating body region24. The restore operation (data restoration from non-volatile memory tovolatile memory) is described with reference to FIGS. 7A and 7B. Priorto the restore operation/process, the floating body 24 is set to apositive charge, i.e., a “1” state is written to floating body 24. Inone embodiment, to perform the restore operation, both SL terminal 72and BL terminal 74 are left floating. A large negative voltage isapplied to WL terminal 70 and a low positive voltage is applied to BWterminal 76. If the floating gate/trapping layer 6) is not negativelycharged, no electrons will tunnel from floating gate/trapping layer 60to floating body 24, and cell 50 will therefore be in a state “1”.Conversely, if floating gate/trapping layer 6) is negatively charged,electrons tunnel from floating gate/trapping layer 60 into floating body24, thereby placing cell 50 in a state “0”. In one particularnon-limiting embodiment, about −18.0 volts is applied to terminal 70,and about +0.6 volts is applied to terminal 76. However, these voltagelevels may vary, while maintaining the relative relationships betweenthe charges applied, as described above. For example, voltage applied toterminal 70 may be in the range of about −12.0 volts to about −20.0volts, and voltage applied to terminal 76 may be in the range of about0.0 volts to about +1.0 volts.

Note that this process occurs non-algorithmically, as the state of thefloating gate/trapping layer 60 does not have to be read, interpreted,or otherwise measure to determine what state to restore the floatingbody 24 to. Rather, the restoration process occurs automatically, drivenby electrical potential differences. Accordingly, this process is ordersof magnitude faster than one that requires algorithmic intervention.Similarly, it is noted that the shadowing process also is performed as anon-algorithmic process. From these operations, it has been shown thatcell 50 provides a memory cell having the advantages of a DRAM cell, butwhere non-volatility is also achieved.

FIGS. 8A-8D illustrate another embodiment of operation of cell 50 toperform a volatile to non-volatile shadowing process, which operates bya hot electron injection process, in contrast to the tunneling process(e.g., Fowler-Nordheim tunneling process) described above with regard toFIGS. 6A-6B. FIG. 8E illustrates the operation of an NPN bipolar device90, as it relates to the operation of cell 50. Floating body 24 isrepresented by the terminal to which voltage V_(FB) is applied in FIG.8E, and the terminals 72 and 74 are represented by terminals to whichvoltages V_(SL) and V_(BL) are applied, respectively. When V_(FB) is apositive voltage, this turns on the bipolar device 90, and when V_(FB)is a negative or neutral voltage, the device 90 is turned off. Likewise,when floating body 24 has a positive voltage, this turns on the cell 50so that current flows through the NPN junction formed by 16, 24 and 18in the direction indicated by the arrow in floating body 24 in FIG. 8A,and when floating body 24 has a negative or neutral voltage, cell isturned off, so that there is no current flow through the NPN junction.

To perform a shadowing process according to the embodiment describedwith regard to FIGS. 8A-8D, a high positive voltage is applied toterminal 72 and a substantially neutral voltage is applied to terminal74. Alternatively, a high positive voltage can be applied to terminal 74and a substantially neutral voltage can be applied to terminal 72. Apositive voltage is applied to terminal 70 and a low positive voltage isapplied to terminal 76. A high voltage in this case is a voltage greaterthan or equal to about +3 volts. In one example, a voltage in the rangeof about +3 to about +6 volts is applied, although it is possible toapply a higher voltage. The floating gate/trapping layer 60 will havebeen previously initialized or reset to have a positive charge prior tothe operation of the cell 50 to store data in non-volatile memory viafloating body 24. When floating body 24 has a positive charge/voltage,the NPN junction is on, as noted above, and electrons flow in thedirection of the arrow shown in the floating body 24 in FIG. 8A. Theapplication of the high voltage to terminal 72 at 16energizes/accelerates electrons traveling through the floating body 24to a sufficient extent that they can “jump over” the oxide barrierbetween floating body 24 and floating gate/trapping layer 60, so thatelectrons enter floating gate/trapping layer 60 as indicated by thearrow into floating gate/trapping layer 60 in FIG. 8A. Accordingly,floating gate/trapping layer 60 becomes negatively charged by theshadowing process, when the volatile memory of cell 50 is in state “1”(i.e., floating body 24 is positively charged), as shown in FIG. 8B.

When volatile memory of cell 50 is in state “0”, i.e., floating body 24has a negative or neutral charge/voltage, the NPN junction is off, asnoted above, and electrons do not flow in the floating body 24, asillustrated in FIG. 8C. Accordingly, when voltages are applied to theterminals as described above, in order to perform the shadowing process,the high positive voltage applied to terminal 72 does not cause anacceleration of electrons in order to cause hot electron injection intofloating gate/trapping layer 60, since the electrons are not flowing.Accordingly, floating gate/trapping layer (60 retains its positivecharge at the end of the shadowing process, when the volatile memory ofcell 50 is in state “0” (i.e., floating body 24 is neutral or negativelycharged), as shown in FIG. 8D. Note that the charge state of thefloating gate/trapping layer 60 is complementary to the charge state ofthe floating body 24 after completion of the shadowing process. Thus, ifthe floating body 24 of the memory cell 50 has a positive charge involatile memory, the floating gate/trapping layer 60 will becomenegatively charged by the shadowing process, whereas if the floatingbody of the memory cell 50 has a negative or neutral charge in volatilememory, the floating gate/trapping layer 60 will be positively chargedat the end of the shadowing operation. The charges/states of thefloating gates/trapping layers 60 are determined non-algorithmically bythe states of the floating bodies, and shadowing of multiple cellsoccurs in parallel, therefore the shadowing process is very fast.

In one particular non-limiting example of the shadowing processaccording to this embodiment, about +3 volts are applied to terminal 72,about 0 volts are applied to terminal 74, about +1.2 volts are appliedto terminal 70, and about +0.6 volts are applied to terminal 76.However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about +3volts to about +6 volts, the voltage applied to terminal 74 may be inthe range of about 0.0 volts to about +0.4 volts, the voltage applied toterminal 70 may be in the range of about 0.0 volts to about +1.6 volts,and voltage applied to terminal 76 may be in the range of about 0.0volts to about +1.0 volts.

Turning now to FIGS. 9A-9B, another embodiment of operation of cell 50to perform a restore process from non-volatile to volatile memory isschematically illustrated, in which the restore process operates by aband-to-band tunneling hot hole injection process (modulated by thefloating gate/trapping layer 60 charge), in contrast to the electrontunneling process described above with regard to FIGS. 7A-7B. In theembodiment illustrated in FIGS. 9A-9B, the floating body 24 is set to aneutral or negative charge prior to the performing the restoreoperation/process, i.e. a “0” state is written to floating body 24. Inthe embodiment of FIGS. 9A-9B, to perform the restore operation,terminal 72 is set to a substantially neutral voltage, a positivevoltage is applied to terminal 74, a negative voltage is applied toterminal 70 and a positive voltage that is less positive than thepositive voltage applied to terminal 74 is applied to terminal 76. Ifthe floating gate/trapping layer 60 is negatively charged, asillustrated in FIG. 9A, this negative charge enhances the driving forcefor the band-to-band hot hole injection process, whereby holes areinjected from the n-region 18 into floating body 24, thereby restoringthe “1” state that the volatile memory cell 50 had held prior to theperformance of the shadowing operation. If the floating gate/trappinglayer 60 is not negatively charged, such as when the floatinggate/trapping layer 60 is positively charged as shown in FIG. 9B or isneutral, the hot band-to-band hole injection process will not occur, asillustrated in FIG. 9B, resulting in memory cell 50 having a “0” state,just as it did prior to performance of the shadowing process.Accordingly, if floating gate/trapping layer 60 has a positive chargeafter shadowing is performed, the volatile memory of floating body 24will be restored to have a negative charge (“0” state), but if thefloating gate/trapping layer 60 has a negative or neutral charge, thevolatile memory of floating body 24 will be restored to have a positivecharge (“1” state).

In one particular non-limiting example of this embodiment, about 0 voltsis applied to terminal 72, about +2 volts is applied to terminal 74,about −1.2 volts is applied to terminal 70, and about +0.6 volts isapplied to terminal 76. However, these voltage levels may vary, whilemaintaining the relative relationships between the charges applied, asdescribed above. For example, voltage applied to terminal 72 may be inthe range of about +1.5 volts to about +3.0 volts, voltage applied toterminal 74 may be in the range of about 0.0 volts to about +0.6 volts,voltage applied to terminal 70 may be in the range of about 0.0 volts toabout −3.0 volts, and voltage applied to terminal 76 may be in the rangeof about 0.0 volts to about +1.0 volts.

Note that this process occurs non-algorithmically, as the state of thefloating gate/trapping layer 60 does not have to be read, interpreted,or otherwise measured to determine what state to restore the floatingbody 24 to. Rather, the restoration process occurs automatically, drivenby electrical potential differences. Accordingly, this process is ordersof magnitude faster than one that requires algorithmic intervention.From these operations, it has been shown that cell 50 provides a memorycell having the advantages of a DRAM cell, but where non-volatility isalso achieved.

After restoring the memory cell(s) 50, the floating gate(s)/trappinglayer(s) 60 is/are reset to a predetermined state, e.g., a positivestate as illustrated in FIG. 10, so that each floating gate/trappinglayer 60 has a known state prior to performing another shadowingoperation. The reset process operates by the mechanism of electrontunneling from the floating gate/trapping layer 60 to the source region18, as illustrated in FIG. 10.

To perform a reset operation according to the embodiment of FIG. 10, ahighly negative voltage is applied to terminal 70, a substantiallyneutral voltage is applied to SL terminal 72, BL terminal 74 is allowedto float or is grounded, and a positive voltage is applied to terminal76. By applying a neutral voltage to terminal 72 and maintaining thevoltage of region 16 to be substantially neutral, this causes region 16to function as a sink for the electrons from floating gate/trappinglayer 60 to travel to by electron tunneling. A large negative voltagesis applied to WL terminal 70 and a low positive voltage is applied to BWterminal 76. If the floating gate/trapping layer 60 is negativelycharged, electrons will tunnel from floating gate/trapping layer 60 toregion 16, and floating gate/trapping layer 60 will therefore becomepositively charged. As a result of the reset operation, all of thefloating gate/trapping layer will become positively charged. In oneparticular non-limiting embodiment, about −18.0 volts is applied toterminal 70, and about +0.6 volts is applied to terminal 76. However,these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 70 may be in the range of about−12.0 volts to about −20.0 volts, and the voltage applied to terminal 76may be in the range of about 0.0 volts to about 1.0 volts.

Having described the various operations of cell 50 above, reference isagain made to FIG. 1 to describe operation of a memory device having aplurality of memory cells 50. The number of memory cells can varywidely, for example ranging from less than 100 Mb to several Gb, ormore. It is noted that, except for the DRAM operations of writing andreading (event 104), which by necessity must be capable of individual,controlled operations, the remaining operations shown in FIG. 1 can allbe carried out as parallel, non-algorithmic operations, which results ina very fast operating memory device.

At event 102, the memory device is initialized by first setting all ofthe floating gates/trapping layers to a positive state, in a manner asdescribed above with reference to FIG. 10, for example. For example, acontrol line can be used to input a highly negative voltage to each ofterminals 70, in parallel, with voltage settings at the other terminalsas described above with reference to FIG. 10. Individual bits (ormultiple bits, as described below) of data can be read from or writtento floating bodies 24 of the respective cells at event 104.

The shadowing operation at event 106 is conducted in a mass parallel,non-algorithmic process, in any of the same manners described above,with each of the cells 50 performing the shadowing operationsimultaneously, in a parallel operation. Because no algorithmicinterpretation or measurement is required to transfer the data fromnon-volatile to volatile memory (24 to 60), the shadowing operation isvery fast and efficient.

To restore the data into the volatile portion of the memory cells 50 ofthe memory device (i.e., restore charges in floating bodies 24), a state“0” is first written into each of the floating bodies 24, by a parallelprocess, and then each of the floating bodies is restored in any of thesame manners described above with regard to a restoration process of asingle floating body 24. This process is also a mass, parallelnon-algorithmic process, so that no algorithmic processing ormeasurement of the states of the floating gates/trapping layers 60 isrequired prior to transferring the data stored by the floatinggates/trapping layers 60 to the floating bodies 24. Thus, the floatingbodies are restored simultaneously, in parallel, in a very fast andefficient process.

Upon restoring the volatile memory at event 108, the floatinggates/trapping layers 60 are then reset at event 102, to establish apositive charge in each of the floating gates/trapping layers, in thesame manner as described above with regard to initializing at event 102.

Up until this point, the description of cells 50 have been in regard tobinary cells, in which the data memories, both volatile andnon-volatile, are binary, meaning that they either store state “1” orstate “0”. FIG. 11A illustrates the states of a binary cell, relative tothreshold voltage, wherein a voltage less than or equal to apredetermined voltage (in one example, the predetermined voltage is 0volts, but the predetermined voltage may be a higher or lower voltage)in floating body 24 is interpreted as state “0”, and a voltage greaterthan the predetermined voltage in floating body 24 is interpreted asstate “1”. However, in an alternative embodiment, the memory cellsdescribed herein can be configured to function as multi-level cells, sothat more than one bit of data can be stored in each cell 50. FIG. 11Billustrates an example of voltage states of a multi-level cell whereintwo bits of data can be stored in each cell 50. In this case, a voltageless than or equal to a first predetermined voltage (e.g., 0 volts orsome other predetermined voltage) and greater than a secondpredetermined voltage that is less than the first predetermined voltage(e.g., about −0.5 volts or some other voltage less than the firstpredetermined voltage) in floating body 24 volts is interpreted as state“01”, a voltage less than or equal to the second predetermined voltageis interpreted as state “00”, a voltage greater than the firstpredetermined voltage and less than or equal to a third predeterminedvoltage that is greater than the first predetermined voltage (e.g. about+0.5 volts or some other predetermined voltage that is greater than thefirst predetermined voltage) is interpreted to be state “10” and avoltage greater than the third predetermined voltage is interpreted asstate “11”.

The memory cell 50 described above with regard to FIGS. 2-10 can bedescribed as a substantially planar memory cell. As the memory cell 50is scaled to sub-50 nm features, it may be beneficial to provide astructure that overcomes short channel effects. As the channel lengthdecreases, less gate charge is required to turn on the transistor. Thisresults in a decrease of the threshold voltage and an increase of theoff state leakage current. A device 50 such as illustrated in FIG. 12suppresses the short channel effect by providing a gate that wrapsaround the silicon body, resulting in a stronger gate control of thetransistor performance.

In addition, it may be advantageous to provide a structure thatfacilitates an increase of memory density over what is possible with asubstantially planar design.

FIGS. 12 and 13 illustrate perspective and top views of an alternativeembodiment of a memory cell 50 according to the present invention. Inthis embodiment, cell 50 has a fin structure 52 fabricated on asilicon-on-insulator (SOI) substrate 12, so as to extend from thesurface of the substrate to form a three-dimensional structure, with fin52 extending substantially perpendicularly to, and above the top surfaceof the substrate 12. Cell 50 is a capacitorless, one-transistor device.Fin structure 52 is conductive and is built on buried insulator layer22, which may be buried oxide (BOX). Insulator layer 22 insulates thefloating substrate region 24, which has a first conductivity type, fromthe bulk substrate 12. Fin structure 52 includes first and secondregions 16, 18 having a second conductivity type. Thus, the floatingbody region 24 is bounded by the top surface of the fin 52, the firstand second regions 16, 18 and the buried insulator layer 22. Fin 52 istypically made of silicon, but may comprise germanium, silicongermanium, gallium arsenide, carbon nanotubes, or other semiconductormaterials known in the art.

Device 50 further includes floating gates or trapping layers 60 on twoopposite sides of the floating substrate region 24, as shown in FIGS. 12and 13. Floating gates/trapping layers 60 are insulated from floatingbody 24 by insulating layers 62. Floating gates/trapping layers 60 arepositioned between the first and second regions 16, 18, adjacent to thefloating body 24. A control gate 66 is capacitively coupled to floatinggates/trapping layers 60 and is insulated therefrom via dielectric layer64. The first and second regions 16, 18 are spaced apart from oneanother on opposite ends of floating body 24 and define the channelregion and the floating substrate region (floating body) 24.

Device 50 includes four terminals: word line (WL) terminal 70, sourceline (SL) terminal 72, bit line (BL) terminal 74 and substrate (SUB)terminal 76. Control gate 66 is connected to terminal 70, first andsecond regions 16, 18 are connected to terminals 72 and 74,respectively, or vice versa, and the bulk substrate 12 is connected toterminal 76.

When power is applied, cell 50 operates in volatile mode, like acapacitorless DRAM cell. That is, data (memory information) is stored inthe floating body 24 of the transistor. The presence of electricalcharge in the floating body 24 modulates the threshold voltage of thedevice 50.

FIGS. 14A-14B illustrate alternative write state “1” operations that canbe carried out on an embodiment of cell 50 as described in FIG. 12-13,by performing band-to-band tunneling hot hole injection (FIG. 14A) orimpact ionization hot hole injection (FIG. 14B). In alternativeembodiments, electrons can be transferred, rather than holes. In FIG.14A, to write a state “1” into the floating body region 24, a neutralvoltage is applied to SL terminal 72, a positive voltage is applied toBL terminal 74, a negative voltage is applied to WL terminal 70 and alarge negative voltage which is more negative than the negative voltageapplied to terminal 70, is applied to SUB terminal 76. Under theseconditions, holes are injected from BL terminal 74 into the floatingbody region 24, leaving the body region 24 positively charged.

In one particular non-limiting embodiment, a charge of about 0.0 voltsis applied to terminal 72, a charge of about +2.0 volts is applied toterminal 74, a charge of about −1.2 volts is applied to terminal 70, anda charge of about −10.0 volts is applied to terminal 76. However, thesevoltage levels may vary, while maintaining the relative relationshipsbetween the charges applied, as described above. For example, voltageapplied to terminal 72 may be in the range of about 0.0 volts to about+0.4 volts, voltage applied to terminal 74 may be in the range of about+1.5 volts to about +3.0 volts, voltage applied to terminal 70 may be inthe range of about 0.0 volts to about −3.0 volts, and voltage applied toterminal 76 may be in the range of about −4.0 volts to about −12.0volts. Further, the voltages applied to terminals 72 and 74 may bereversed, and still obtain the same result.

Alternatively, as illustrated in FIG. 14B, to write a state “1” into thefloating body region 24, a substantially neutral voltage is applied toSL terminal 72, a positive voltage is applied to BL terminal 74, apositive voltage less positive than the positive voltage applied toterminals 72 and 74 is applied to WL terminal 70 and a negative isapplied to SUB terminal 76. Under these conditions, holes are injectedfrom BL terminal 74 into the floating body region 24, leaving the bodyregion 24 positively charged.

In one particular non-limiting embodiment, about 0.0 volts is applied toterminal 72, about +2.0 volts is applied to terminal 74, about +1.2volts is applied to terminal 70, and about −10.0 volts is applied toterminal 76. However, these voltage levels may vary, while maintainingthe relative relationships between the charges applied, as describedabove. For example, voltage applied to terminal 72 may be in the rangeof about 0.0 volts to about +0.6 volts, voltage applied to terminal 74may be in the range of about +1.5 volts to about +3.0 volts, voltageapplied to terminal 70 may be in the range of about 0.0 volts to about+1.6 volts, and voltage applied to terminal 76 may be in the range ofabout −4.0 volts to about −12.0 volts. Further, the voltages applied toterminals 72 and 74 may be reversed, and still obtain the same result,e.g., a positive voltage applied to terminal 72 and a neutral chargeapplied to terminal 74.

FIG. 15 illustrates a write state “0” operation that can be carried outon cell 50. To write a state “0” into floating body region 24, anegative voltage is applied to SL terminal 72, a substantially neutralvoltage is applied to BL terminal 74, a negative voltage that is lessnegative than the negative voltage applied to terminal 72 is applied toWL terminal 70 and a substantially neutral voltage is applied to SUBterminal 76. Under these conditions, all p-n junctions (junction between24 and 16 and between 24 and 18) are forward-biased, evacuating anyholes from the floating body 24.

In one particular non-limiting embodiment, about −2.0 volts is appliedto terminal 72, about 0.0 volts is applied to terminal 74, about −1.2volts is applied to terminal 70, and about 0.0 volts is applied toterminal 76. However, these voltage levels may vary, while maintainingthe relative relationships between the charges applied, as describedabove. For example, voltage applied to terminal 72 may be in the rangeof about −1.0 volts to about −3.0 volts, voltage applied to terminal 74may be in the range of about 0.0 volts to about −3.0 volts, voltageapplied to terminal 70 may be in the range of about 0.0 volts to about−3.0 volts, and voltage applied to terminal 76 may be in the range ofabout 0.0 volts to about +2.0 volts. Further, the voltages applied toterminals 72 and 74 may be reversed, and still obtain the same result,e.g., a substantially neutral voltage applied to terminal 72 and anegative charge applied to terminal 74.

A read operation of the cell 50 is now described with reference to FIG.16. To read cell 50, a substantially neutral charge is applied to SLterminal 72, a positive voltage is applied to BL terminal 74, a positivevoltage that is more positive than the positive voltage applied toterminal 74 is applied to WL terminal 70 and a negative voltage isapplied to SUB terminal 76. If cell 50 is in a state “1” having holes inthe body region 24, then a lower threshold voltage (gate voltage wherethe transistor is turned on) is observed compared to the thresholdvoltage observed when cell 50 is in a state “0” having no holes in bodyregion 24.

In one particular non-limiting embodiment, about 0.0 volts is applied toterminal 72, about +0.4 volts is applied to terminal 74, about +1.2volts is applied to terminal 70, and about −10.0 volts is applied toterminal 76. However, these voltage levels may vary, while maintainingthe relative relationships between the charges applied, as describedabove. For example, terminal 72 is grounded and is thus at about 0.0volts, voltage applied to terminal 74 may be in the range of about +0.1volts to about +1.0 volts, voltage applied to terminal 70 may be in therange of about +1.0 volts to about +3.0 volts, and voltage applied toterminal 76 may be in the range of about −4.0 volts to about −12.0volts. Further, the voltages applied to terminals 72 and 74 may bereversed, and still obtain the same result. e.g., a positive voltageapplied to terminal 72 and a neutral charge applied to terminal 74.

When power down is detected, e.g., when a user turns off the power tocell 50, or the power is inadvertently interrupted, or for any otherreason, power is at least temporarily discontinued to cell 50, datastored in the floating body region 24 is transferred to floatinggate/trapping layer 60 via a shadowing operation. With reference toFIGS. 17A and 178, the shadowing operation may be performed by firstapplying a high positive voltage to terminal 72. After a short period oftime (e.g., a time period in the range of about 500 ns to about 10 μs,typically about 1 μs), the voltage applied to terminal 72 is broughtdown to substantially neutral (i.e., ground), followed by application ofa high positive voltage to terminal 70. A negative voltage is applied toterminal 76 throughout the operation, and a substantially neutralvoltage is applied to terminal 74. If the memory transistor does nothave holes in the floating substrate 24 (state “0”) the voltageconditions applied to cell 50 as described will result in a potentialdifference between the n⁺ junctions and the p-type floating substrate24, sufficient to generate substrate transient hot electrons. If cell 50is in a state “1” (i.e., memory transistor has holes in the floatingsubstrate 24), a lower electric field between the n⁺ junctions and thep-type floating substrate 24 exists, and, as a result, no transient hotelectrons are generated. In the former case (state “0”) the transienthot electrons that are generated are collected in the floatinggate/trapping layer 64 due to the electric field resulting from the highpositive bias applied on the control gate 66 via terminal 70.Alternatively, a high negative voltage can be applied to terminal 70 tocollect transient hot holes.

In one particular non-limiting embodiment, a voltage of about +6.0 voltsis initially applied to terminal 72. After bringing the voltage appliedto terminal 72 down to ground, a voltage of about +10.0 volts is appliedto terminal 70. Voltages of about 0 volts and about −10.0 volts,respectively, are applied to terminals 74 and 76 throughout the process.However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about+3.0 volts to about +6.0 volts, prior to dropping the voltage to about 0volts; voltage applied to terminal 70 may be in the range of about +3.0volts to about +12.0 volts; voltage applied to terminal 74 may be in therange of about 0.0 volts to about +0.6 volts, and voltage applied toterminal 76 may be in the range of about −4.0 volts to about −12.0volts. Further, the voltages applied to terminals 72 and 74 may bereversed, and still obtain the same result.

When power is restored to cell 50, the state of the cell 50 memorytransistor as stored on floating gate/trapping layer 60 is restored intofloating body region 24. The restore operation (data restoration fromnon-volatile memory to volatile memory) is described with reference toFIG. 18. Prior to the restore operation/process, the floating body 24 isset to a neutral or negative charge, i.e., a “0” state is written tofloating body 24. In one embodiment, to perform the restore operation, asubstantially neutral voltage is applied to terminal 72, a positivevoltage is applied to terminal 74, a positive voltage that is lesspositive than the positive voltage applied to terminal 74 is applied toterminal 70, and a negative voltage is applied to terminal 76, if thefloating gate/trapping layer 60 is not negatively charged, holes areinjected from the BL terminal 74 into the floating body 24, leaving thefloating body 24 positively charged and therefore in a state “1”.Conversely, if floating gate/trapping layer 60 is negatively charged, nohole injection occurs into the floating substrate 24 and thereforefloating substrate 24 results in state “0”.

Still referring to FIG. 18, in one non-limiting exemplary embodiment ofthe restore process, a voltage of about 0 volts is applied to terminal72, a voltage of about +2.0 volts is applied to terminal 74, a voltageof about +1.2 volts is applied to terminal 70, and a voltage of about−10 volts is applied to terminal 76. However, these voltage levels mayvary, while maintaining the relative relationships between the chargesapplied, as described above. For example, voltage applied to terminal 70may be in the range of about 0.0 volts to about +1.6 volts, voltageapplied to terminal 72 may be in the range of about 0.0 volts to about+0.6 volts, voltage applied to terminal 74 may be in the range of about+1.5 volts to about +3.0 volts, and voltage applied to terminal 76 maybe in the range of about −4.0 volts to about −12.0 volts. Further, thevoltages applied to terminals 72 and 74 may be reversed, and stillobtain the same result.

In another embodiment of operation of the cell 50 of FIG. 12 to performa volatile to non-volatile shadowing process, the process operates by ahot electron injection process. To perform a shadowing process accordingto this embodiment, a high positive voltage is applied to terminal 72and a substantially neutral voltage is applied to terminal 74.Alternatively, a high positive voltage can be applied to terminal 74 anda substantially neutral voltage can be applied to terminal 72. Apositive voltage is applied to terminal 70 and a negative voltage isapplied to terminal 76. A high voltage in this case is a voltage greaterthan or equal to about +3 volts. In one example, a voltage in the rangeof about +3 to about +6 volts is applied, although it is possible toapply a higher voltage.

The floating gate/trapping layer 60 will have been previouslyinitialized or reset to have a positive charge prior to the operation ofthe cell 50 to store data in non-volatile memory via floating body 24.When floating body 24 has a positive charge/voltage, the NPN junction ison, as noted above. The application of the high voltage to terminal 72at 16 energizes/accelerates electrons traveling through the floatingbody 24 to a sufficient extent that they can “jump over” the oxidebarrier 62 between floating body 24 and floating gate/trapping layer 60,so that electrons enter floating gate/trapping layer 60. Accordingly,floating gate/trapping layer 60 becomes negatively charged by theshadowing process, when the volatile memory of cell 50 is in state “1”(i.e., floating body 24 is positively charged).

When volatile memory of cell 50 is in state “0”, i.e., floating body 24has a negative or neutral charge/voltage, the NPN junction is off asnoted above, and electrons do not flow in the floating body 24.Accordingly, when voltages are applied to the terminals as describedabove, in order to perform the shadowing process, the high positivevoltage applied to terminal 72 does not cause an acceleration ofelectrons in order to cause hot electron injection into floatinggate/trapping layer 60, since the electrons are not flowing.Accordingly, floating gate/trapping layer 60 retains its positive chargeat the end of the shadowing process, when the volatile memory of cell 50is in state “0” (i.e., floating body 24 is neutral or negativelycharged). Note that the charge state of the floating gate/trapping layer60 is complementary to the charge state of the floating body 24 aftercompletion of the shadowing process. Thus, if the floating body 24 ofthe memory cell 50 has a positive charge in volatile memory, thefloating gate/trapping layer 60 will become negatively charged by theshadowing process, whereas if the floating body of the memory cell 50has a negative or neutral charge in volatile memory, the floatinggate/trapping layer 60 will be positively charged at the end of theshadowing operation. The charges/states of the floating gates/trappinglayers 60 are determined non-algorithmically by the states of thefloating bodies, and shadowing of multiple cells occurs in parallel,therefore the shadowing process is very fast.

In one particular non-limiting example of the shadowing processaccording to this embodiment, about +3 volts are applied to terminal 72,about 0 volts are applied to terminal 74, about +1.2 volts are appliedto terminal 70, and about −10.0 volts are applied to terminal 76.However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about +3volts to about +6 volts, the voltage applied to terminal 74 may be inthe range of about 0.0 volts to about +0.4 volts, the voltage applied toterminal 70 may be in the range of about 0.0 volts to about +1.6 volts,and voltage applied to terminal 76 may be in the range of about −4.0volts to about −12.0 volts.

In another embodiment to perform a restore process, terminal 72 is setto a substantially neutral voltage, a positive voltage is applied toterminal 74, a negative voltage is applied to terminal 70 and a negativevoltage that is more negative than the negative voltage applied toterminal 70 is applied to terminal 76. If the floating gate/trappinglayer 60 is negatively charged, this negative charge enhances thedriving force for the band-to-band hot hole injection process, wherebyholes are injected from the n-region 18 into floating body 24, therebyrestoring the “1” state that the volatile memory cell 50 had held priorto the performance of the shadowing operation. If the floatinggate/trapping layer 60 is not negatively charged, such as when thefloating gate/trapping layer 60 is positively charged or is neutral, thehot band-to-band hole injection process will not occur, resulting inmemory cell 50 having a “0” state, just as it did prior to performanceof the shadowing process. Accordingly, if floating gate/trapping layer60 has a positive charge after shadowing is performed, the volatilememory of floating body 24 will be restored to have a negative charge(“0” state), but if the floating gate/trapping layer 60 has a negativeor neutral charge, the volatile memory of floating body 24 will berestored to have a positive charge (“1” state).

In one particular non-limiting example of this embodiment, about 0 voltsis applied to terminal 72, about +2 volts is applied to terminal 74,about −1.2 volts is applied to terminal 70, and about +0.6 volts isapplied to terminal 76. However, these voltage levels may vary, whilemaintaining the relative relationships between the charges applied, asdescribed above. For example, voltage applied to terminal 72 may be inthe range of about +1.5 volts to about +3.0 volts, voltage applied toterminal 74 may be in the range of about 0.0 volts to about +0.6 volts,voltage applied to terminal 70 may be in the range of about 0.0 volts toabout −3.0 volts, and voltage applied to terminal 76 may be in the rangeof about −4.0 volts to about −12.0 volts.

Note that the restore processes described above are non-algorithmicprocesses, as the state of the floating gate/trapping layer 60 does nothave to be read, interpreted, or otherwise measured to determine whatstate to restore the floating body 24 to. Rather, the restorationprocess occurs automatically, driven by electrical potentialdifferences. Accordingly, this process is orders of magnitude fasterthan one that requires algorithmic intervention. Similarly, it is notedthat the shadowing processes described above are also performed asnon-algorithmic processes. When multiple cells 50 are provided in amemory device, shadowing and restore operations are performed asparallel, non-algorithmic processes. From these operations, it has beenshown that cell 50 provides a memory cell having the advantages of aDRAM cell, but where non-volatility is also achieved, and wherein a finis provided to facilitate denser packing of memory cells and to suppressshort channel effects, which in turn allows device scaling to smallergeometry.

After restoring the memory cell(s) 50, the floating gate(s)/trappinglayer(s) 60 is/are reset to a predetermined initial state, e.g., apositive state as illustrated in FIG. 19, so that each floatinggate/trapping layer 60 has a known state prior to performing anothershadowing operation. The reset process operates by the mechanism ofelectron tunneling from the floating gate/trapping layer 60 to thesource region 18, as illustrated in FIG. 19.

To perform a reset operation according to the embodiment of FIG. 19, ahighly negative voltage is applied to terminal 70, a substantiallyneutral voltage is applied to SL terminal 72, BL terminal 74 is allowedto float or is grounded (e.g., a substantially neutral charge can beapplied), and a negative voltage that is less negative than the negativevoltage applied to terminal 70 is applied to terminal 76. By applying aneutral voltage to terminal 72 and maintaining the voltage of region 16to be substantially neutral, this causes region 16 to function as a sinkfor the electrons from floating gate/trapping layer 60 to travel to byelectron tunneling. A large negative voltage is applied to WL terminal70 and a less negative voltage is applied to SUB terminal 76. If thefloating gate/trapping layer 60 is negatively charged, electrons willtunnel from floating gate/trapping layer 60 to region 16, and floatinggate/trapping layer 60 will therefore become positively charged. As aresult of the reset operation, all of the floating gate/trapping layerwill become positively charged. In one particular non-limitingembodiment, about −18.0 volts is applied to terminal 70, and about −10.0volts is applied to terminal 76. However, these voltage levels may vary,while maintaining the relative relationships between the chargesapplied, as described above. For example, voltage applied to terminal 70may be in the range of about −12.0 volts to about −20.0 volts, voltageapplied to terminal 72 may be in the range of about 0.0 volts to about+3.0 volts, voltage applied to terminal 74 may be in the range of about0.0 volts to about +3.0 volts, and the voltage applied to terminal 76may be in the range of about −4.0 volts to about −12.0 volts. Further,the voltages applied to terminals 72 and 74 may be reversed, and stillobtain the same result.

Alternatively, if hot holes are collected during the shadowingoperation, then a high positive voltage (e.g., about +18.0 volts, or avoltage in the range of about +12.0 volts to about +20.0 volts isapplied to terminal 70 to reset the floating gate(s)/trapping layer(s)60 to the initial state. Under this condition, electrons will tunnelinto the floating gate(s)/trapping layer(s) 60 from the n⁺ junctionregion (either 16 or 18, or both, depending on whichever region(s)is/are grounded), resulting in the floating gate(s)/trapping layer(s) 60being negatively charged in the initial state.

Referring now to FIG. 20, a cross-sectional schematic illustration of amemory string 500 that includes a plurality of memory cells 50 is shownMemory string 50) includes a plurality of memory cells 50 connected in aNAND architecture, in which the plurality of memory cells 50 areserially connected to make one string of memory cells. String 500includes “n” memory cells 50, where “n” is a positive integer, whichtypically ranges between 8 and 64, and in at least one example, is 16.

String 500 includes a selection transistor 68, a ground selectiontransistor 80, and a plurality (i.e., “n”) memory cell transistors 50(50 a, 50 b, . . . , 50 m, 50 n), all of which are connected in series.Each memory cell transistor 50 includes a floating body region 24 of afirst conducting type, and first and second regions 20 (corresponding tofirst and second regions 16 and 18 in the single cell embodiments ofcell 50 described above) of a second conductivity type, which are spacedapart from each other and define a channel region. A buried insulatorlayer 22 isolates the floating body region 24 from the bulk substrate12. A floating gate or trapping layer 60 is positioned above the surfaceof floating body 24 and is in between the first and second regions 20.An insulating layer 62 is provided between floating gate/trapping layer60 and floating body 24 to insulate floating gate/trapping layer 60 fromfloating body 24. A control gate 66 is insulated and separated from thefloating gate/trapping layer 60 by an insulating layer 64. The controlgate 66 is capacitively coupled to the floating gate/trapping layer 60.The relationship between the floating gate/trapping layer 60 and thecontrol gate 66 is similar to that of a non-volatile stacked gatefloating gate memory cell. Cells 50 may be provided as substantiallyplanar cells, such as the embodiments described above with reference toFIGS. 1-10, or may be provided as fin-type, three-dimensional cells,such as the embodiments described above with reference to FIGS. 12-19.Other variations, modifications and alternative cells 50 may be providedwithout departing from the scope of the present invention and itsfunctionality.

FIG. 21 illustrates a top view of the string 500. As noted, the memorycell transistors 50 are serially connected. A memory array is typicallyarranged in a grid, with the WL terminal being used to select the rowand the BL terminal being sued to select the column, so that, incombination, any single memory cell (or more) in the grid can beselected. String 500 lies in the column direction of the grid. Thus, theserial connection arrangement typically defines a memory array columndirection. Adjacent columns are separated by columns of isolation, suchas shallow trench isolation (STI). The drain region of the stringselection transistor 68 is connected to the bit line (BL) 74. FIG. 21illustrates two columns, and thus, two bit lines 74, for exemplarypurposes. In practice, there will typically be many more than twocolumns. The source region of the ground selection transistor 80 isconnected to the SL terminal 72. The control gates 66 extend in rowdirections. As can also be seen in FIG. 21, the WL and BL pitches caneach be made to be 2 F, where F is defined as the feature size (thesmallest lithography feature). Accordingly, each memory cell transistor50 has a size of 4 F².

FIGS. 22A-22B illustrate alternative write state “1” operations that canbe carried out string 500, by performing band-to-band tunneling hot holeinjection (FIG. 22A) or impact ionization hot hole injection (FIG. 22B).In alternative embodiments, electrons can be transferred, rather thanholes. In FIG. 22A, to write a state “1” into a floating body region 24of a selected cell 50, a substantially neutral voltage is to terminal72, a positive voltage is applied to BL terminal 74, a negative voltageis applied to the selected control gate 66 (i.e., 66 b in the example ofFIG. 22A) via terminal 70 of the selected memory cell 50, a positivevoltage, more positive that the positive voltage applied to terminal 74is applied to the passing control gates 66 (i.e., control gates 66 ofthe cells 50 not having been selected), positive voltage about equal tothe positive voltage applied to the passing control gates 66 is appliedto the gates of the string selection transistor 68 and the groundselection transistor 80, and a negative voltage more negative than thenegative voltage applied to the selected control gate 66 is applied tothe substrate via terminal 76. The voltages applied to the selectiontransistors 68 and 80 and the passing control gates 66 are such that thechannel regions underneath the respective gates of these transistors areturned on. Under these conditions, holes are injected from the drainside of the selected memory transistor 50 into the floating substrateregion 24 of the selected memory transistor 50 leaving the floatingsubstrate positively charged, i.e. in the “1” state.

In one particular non-limiting embodiment, as illustrated in FIG. 22A, avoltage of about 0.0 volts is applied to terminal 72, about +2.0 voltsis applied to terminal 74, about −1.2 volts is applied to terminal 70 ofthe selected control gate 66, about +3.0 is applied to the terminals 70of the passing control gates 66, about +3.0 volts is applied to the gateof the string selection transistor 68, about +3.0 volts is applied tothe gate of the ground selection transistor 80, and a voltage of about−10.0 volts is applied to the substrate via terminal 76. However, thesevoltage levels may vary, while maintaining the relative relationshipsbetween the charges applied, as described above. For example, voltageapplied to terminal 72 may be in the range of about 0.0 volts to about+0.6 volts, voltage applied to terminal 74 may be in the range of about+1.5 volts to about +3.0 volts, voltage applied to terminal 70 of theselected control gate 66 may be in the range of about 0.0 volts to about−3.0 volts, voltage applied to the terminals 70 of the passing controlgates 66 of the cells 50 not selected may be in the range of about +2.0volts to about +6.0 volts, voltage applied to the gate of the stringselection transistor 68 may be in the range of about +1.0 volts to about+5.0 volts, voltage applied to the gate of the ground selectiontransistor 80 may be in the range of about +1.0 volts to about +5.0volts, and voltage applied to terminal 76 may be in the range of about−4.0 volts to about −12.0 volts. Further, the voltages applied toterminals 72 and 74 may be reversed, and still obtain the same result,even when the voltages applied to terminals 72 and 74 are not equal.

Alternatively, as illustrated in FIG. 22B, to write a state “1” into thefloating body region 24 of a selected memory cell transistor 50, asubstantially neutral voltage may be applied to terminal 72, a positivevoltage may be applied to BL terminal 74, a positive voltage lesspositive than the positive voltage applied to terminal 74 may be appliedto gate 66 of the selected cell 50 via terminal 70 of the selected cell50, a positive voltage more positive than the positive voltage appliedto terminal 74 is applied to terminals 70 of each of the non-selectedcells 50, a positive voltage more positive than the positive voltageapplied to terminal 74 is applied to the gate of string selectiontransistor 68, a positive voltage more positive than the positivevoltage applied to terminal 74 is applied to the gate of groundselection transistor 80, and a negative voltage is applied to thesubstrate via terminal 76. Under these conditions, holes are injectedfrom the drain side of the selected memory transistor cell 50 into thefloating body region 24 of the selected memory cell 50, leaving the bodyregion 24 positively charged and thus putting the selected memory cell50 in state “1”.

In one particular non-limiting embodiment as illustrated in FIG. 22B,about 0.0 volts is applied to terminal 72, about +2.0 volts is appliedto terminal 74, about +1.2 volts is applied to control gate (66 viaterminal 70 of the selected memory cell (in this example, cell 50 b),about +3.0 volts is applied to each of the control gates 66 of thenon-selected memory cells, a voltage of about +3.0 volts is applied tothe gate of the string selection transistor 68, a voltage of about +3.0volts is applied to the gate of the ground selection transistor 80, anda voltage of about −10.0 volts is applied to terminal 76.

However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about 0.0volts to about +0.6 volts, voltage applied to terminal 74 may be in therange of about +1.5 volts to about +3.0 volts, voltage applied toterminal 70 of the selected control gate 66 may be in the range of about0.0 volts to about +1.6 volts, voltage applied to the terminals 70 ofthe passing control gates 66 of the cells 50 not selected may be in therange of about +1.0 volts to about +5.0 volts, voltage applied to thegate of the string selection transistor 68 may be in the range of about+1.0 volts to about +5.0 volts, voltage applied to the gate of theground selection transistor 80 may be in the range of about +1.0 voltsto about +5.0 volts, and voltage applied to terminal 76 may be in therange of about −4.0 volts to about −12.0 volts. Further, the voltagesapplied to terminals 72 and 74 may be reversed, and still obtain thesame result.

FIG. 23 illustrates an example of a write state “0” operation carriedout on a selected cell 50 of the string 500. To write a state “0” intothe floating body region 24 of a selected memory cell transistor, anegative voltage is applied to SL terminal 72, a substantially neutralvoltage is applied to BL terminal 74, a substantially neutral voltage isapplied to all of the control gates 66 via their respective WL terminals70, a positive voltage is applied to the gate of the ground selectiontransistor 80, a substantially neutral voltage is applied to the gate ofthe string selection transistor 68, and a substantially neutral voltageis applied to the substrate via terminal 76. Under these conditions, allp-n junctions are forward-biased, evacuating any holes from the floatingbody 24. The write “0” operation is performed simultaneously on allcells sharing the same SL terminal 72.

In one particular non-limiting embodiment, as illustrated in FIG. 23,about −2.0 volts is applied to terminal 72, about 0.0 volts is appliedto terminal 74, about 0.0 volts is applied to each of terminals 70, avoltage of about +3.0 volts is applied to the gate of the groundselection transistor 80, a voltage of about 0.0 volts is applied to thegate of the string selection transistor 68, and about 0.0 volts isapplied to terminal 76.

However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about−1.0 volts to about −3.0 volts, voltage applied to terminal 74 may be inthe range of about 0.0 volts to about −3.0 volts, voltage applied toeach of the terminals 70 may be in the range of about 0.0 volts to about−3.0 volts, voltage applied to the gate of the string selectiontransistor 68 may be in the range of about 0.0 volts to about 5.0 volts,voltage applied to the gate of the ground selection transistor 80 may bein the range of about 0.0 volts to about +5.0 volts, and voltage appliedto terminal 76 may be in the range of about 0.0 volts to about +2.0volts. Further, the voltages applied to terminals 72 and 74 may bereversed, and still obtain the same result, even when the voltagesapplied to terminals 72 and 74 are not equal.

A read operation is now described with reference to FIG. 24. To read thedata of a selected cell 50, a substantially neutral charge is applied toSL terminal 72, a positive voltage is applied to BL terminal 74, apositive voltage that is more positive than the positive voltage appliedto terminal 74 is applied to WL terminal 70 of the control gate 66 ofthe selected cell 50, a positive voltage that is more positive than thepositive voltage applied to the terminal 70 of the selected cell isapplied to each of passing control gates 66 via the terminals 70 of thenon-selected cells 50, a positive voltage that is more positive than thepositive voltage applied to the terminal 70 of the selected cell isapplied to the gate of the string selection transistor 68, a positivevoltage that is more positive than the positive voltage applied to theterminal 70 of the selected cell is applied to the gate of the groundselection terminal 80, and a negative voltage is applied to terminal 76.The voltages applied to the selection transistors 68, 80 and the passingcontrol gates 66 are such that the channel regions underneath thesegates are turned on. If the selected memory transistor cell 50 is in astate “1” having holes in the floating body region 24 thereof, then arelatively lower threshold voltage is observed, relative to when theselected memory transistor cell 50 is in a state “0” and has no holes inthe floating body region 24.

In one particular non-limiting embodiment, about 0.0 volts is applied toterminal 72, about +0.4 volts is applied to terminal 74, about +1.2volts is applied to terminal 70 (and thus control gate 66) of theselected memory cell 50, about +3.0 volts is applied to each of theterminals 70 (and thus the passing control gates 66) of the non-selectedmemory cells 50, a voltage of about +3.0 volts is applied to the gate ofthe string selection transistor 68, a voltage of about +3.0 volts isapplied to the gate of the ground selection transistor 80, and about−10.0 volts is applied to terminal 76.

However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, terminal 72 is grounded, and thus at about 0.0 volts, voltageapplied to terminal 74 may be in the range of about +0.1 volts to about+1.0 volts, voltage applied to terminal 70 of the selected control gate66 may be in the range of about 0.0 volts to about +3.0 volts; voltageapplied to the terminals 70 of the passing control gates 66 of the cells50 not selected may be in the range of about +1.0 volts to about +5.0volts, voltage applied to the gate of the string selection transistor 68may be in the range of about +1.0 volts to about +5.0 volts, voltageapplied to the gate of the ground selection transistor 80 may be in therange of about +1.0 volts to about +5.0 volts, and voltage applied toterminal 76 may be in the range of about −4.0 volts to about −12.0volts. Further, the voltages applied to terminals 72 and 74 may bereversed, and still obtain the same result, even when the voltagesapplied to terminals 72 and 74 are not equal.

When power down is detected, e.g., when a user turns off the power tostring 500, or the power is inadvertently interrupted, or for any otherreason, power is at least temporarily discontinued to string 500, datastored in the floating body regions 24 are transferred to floatinggate/trapping layers 60 via a shadowing operation. With reference toFIGS. 25A and 25B, the shadowing operation may be performed by firstapplying a high positive voltage to terminal 72. After a short period oftime, e.g. about 1 μs or a short period of time in the range from about500 ns to about 10 μs, the voltage applied to terminal 72 is broughtdown to substantially neutral (i.e., ground), followed by application ofa high positive voltage to each of terminals 70 and thus to each ofcontrol gates 66. A negative voltage is applied to terminal 76throughout the operation, and a substantially neutral voltage is appliedto terminal 74. If a memory transistor cell 50 does not have holes inthe floating substrate 24 (state “0”) the voltage conditions applied tothat cell 50 as described will result in a potential difference betweenthe n⁺ junctions and the p-type floating substrate 24, sufficient togenerate substrate transient hot electrons. If a cell 50 is in a state“1” (i.e., memory transistor cell 50 has holes in the floating substrate24), a lower electric field between the n⁺ junctions and the p-typefloating substrate 24 exists, and, as a result, no transient hotelectrons are generated. In the former case (state “0”) the transienthot electrons that are generated are collected in the floatinggate/trapping layer 60 of that cell 50 due to the electric fieldresulting from the high positive bias applied on the control gate 66 viaterminal 70. As to cells 50 that are in state “1”, transient hotelectrons are not collected at the floating gates/trapping layers 60) ofthose cells 50. Alternatively, a high negative voltage can be applied toall terminals 70 to collect transient hot holes from floating bodies instate “1”.

In one particular non-limiting embodiment, as illustrated in FIGS.25A-25B, a voltage of about +6.0 volts is initially applied to terminal72. After bringing the voltage applied to terminal 72 down to ground, avoltage of about +10.0 volts is applied to each terminal 70. Voltages ofabout 0 volts and about −10.0 volts, respectively, are applied toterminals 74 and 76 throughout the process. However, these voltagelevels may vary, while maintaining the relative relationships betweenthe charges applied, as described above. For example, voltage applied toterminal 72 may be in the range of about +3.0 volts to about +6.0 volts,prior to dropping the voltage to about 0 volts; voltage applied toterminals 70 may be in the range of about +3.0 volts to about +12.0volts; voltage applied to terminal 74 may be in the range of about 0.0volts to about +0.6 volts, and voltage applied to terminal 76 may be inthe range of about −4.0 volts to about −12.0 volts. Further, thevoltages applied to terminals 72 and 74 may be reversed, and stillobtain the same result.

When power is restored to string 500, the states of the memory celltransistors 50 memory as stored on the floating gates/trapping layers 60are restored into floating body regions 24. The restore operation (datarestoration from non-volatile memory to volatile memory) is describedwith reference to FIG. 26. Prior to the restore operation/process, thefloating bodies 24 are set to a neutral or negative charge, i.e., a “0”state is written to each floating body 24, via a parallel write processaccording to a write “0” process described above. In one embodiment, toperform the restore operation, a substantially neutral voltage isapplied to terminal 72, a positive voltage is applied to terminal 74, apositive voltage that is less positive than the positive voltage appliedto terminal 74 is applied to each selected terminal 70 of each selectedcell 50, a positive voltage that is more positive than the positivevoltage applied to terminal 74 is applied to each passing control gatevia each terminal 70 of each non-selected cell 50, a positive voltagethat is more positive than the positive voltage applied to terminal 74is applied to the gate of the string selection transistor 68, a positivevoltage that is more positive than the positive voltage applied toterminal 74 is applied to the gate of the ground selection transistor,and a negative voltage is applied to terminal 76. Under theseconditions, if a floating gate/trapping layer 60 of a selected memorycell is not negatively charged, holes are injected from the drain sideof that selected memory transistor 50 to the floating body region 24 ofthat cell, leaving it positively charged, i.e., state “1”. Conversely,if the floating gate/trapping layer 60 of a selected cell 50 isnegatively charged, no hole injection occurs into the floating substrate24 of that cell 50 and therefore the floating substrate 24 of the cellresults in state “0”.

in one non-limiting exemplary embodiment of the restore process, avoltage of about 0 volts is applied to terminal 72, a voltage of about+2.0 volts is applied to terminal 74, a voltage of about +1.2 volts isapplied to terminal 70 of each selected cell 50, a voltage of about +3.0volts is applied to each terminal 70 of each non-selected cell 50, avoltage of about +3.0 volts is applied to the gate of the stringselection transistor 68, a voltage of about +3.0 volts is applied to thegate of the ground selection transistor 80, and a voltage of about −10volts is applied to terminal 76.

However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about 0.0volts to about +0.6 volts, voltage applied to terminal 74 may be in therange of about +1.5 volts to about +3.0 volts, voltage applied toterminal 70 of the selected control gate 66 may be in the range of about0.0 volts to about +1.6 volts; voltage applied to the terminals 70 ofthe passing control gates 66 of the cells 50 not selected may be in therange of about +1.0 volts to about +5.0 volts, voltage applied to thegate of the string selection transistor 68 may be in the range of about+1.0 volts to about +5.0 volts, voltage applied to the gate of theground selection transistor 80 may be in the range of about +1.0 voltsto about +5.0 volts, and voltage applied to terminal 76 may be in therange of about −4.0 volts to about −12.0 volts. Further, the voltagesapplied to terminals 72 and 74 may be reversed, and still obtain thesame result, even when the voltages applied to terminals 72 and 74 arenot equal.

Note that this process occurs non-algorithmically in parallel (only nparallel operations are needed for an entire array of n×m cells 50,where m is a positive integer indicating the number of rows in thearray), as the state of the floating gates/trapping layers 60 do nothave to be read, interpreted, or otherwise measured to determine whatstate to restore the floating bodies 24 to. Rather, the restorationprocess occurs automatically, driven by electrical potentialdifferences. Accordingly, this process is orders of magnitude fasterthan one that requires algorithmic intervention. Similarly, it is notedthat the shadowing process also is performed as a parallel,non-algorithmic process. When multiple cells 50 are provided in a memorydevice, shadowing and restore operations are performed as parallel,non-algorithmic processes.

in another embodiment of string 50 can be operated to perform a volatileto non-volatile shadowing process by a hot electron injection process.To perform a shadowing process according to this embodiment, a highpositive voltage is applied to terminal 72 and a substantially neutralvoltage is applied to terminal 74. Alternatively, a high positivevoltage can be applied to terminal 74 and a substantially neutralvoltage can be applied to terminal 72. A positive voltage is applied toterminal 70 of the selected cell 50, a positive voltage that is morepositive than the positive voltage applied to the terminal 70 of theselected cell is applied to each of passing control gates 66 via theterminals 70 of the non-selected cells 50, a positive voltage morepositive than the positive voltage applied to terminal 74 is applied tothe gate of string selection transistor 68, a positive voltage morepositive than the positive voltage applied to terminal 74 is applied tothe gate of ground selection transistor 80, and a negative voltage isapplied to terminal 76. A high voltage in this case is a voltage greaterthan or equal to about +3 volts. In one example, a voltage in the rangeof about +3 to about +6 volts is applied, although it is possible toapply a higher voltage. The floating gate/trapping layer 60 will havebeen previously initialized or reset to have a positive charge prior tothe operation of the cell 50 to store data in non-volatile memory viafloating body 24. When floating body 24 of a selected cell 50 has apositive charge/voltage, the NPN junction is on, as noted above, andelectrons flow in the floating body 24. The application of the highvoltage to terminal 72 at 16 energizes/accelerates electrons travelingthrough the floating body 24 to a sufficient extent that they can “jumpover” the oxide barrier 62 between floating body 24 and floatinggate/trapping layer 60, so that electrons enter floating gate/trappinglayer 60. Accordingly, floating gate/trapping layer 60 becomesnegatively charged by the shadowing process, when the volatile memory ofcell 50 is in state “1” (i.e., floating body 24 is positively charged).

When volatile memory of a selected cell 50 is in state “0”, i.e.,floating body 24 has a negative or neutral charge/voltage, the NPNjunction is off, as noted above, and electrons do not flow in thefloating body 24. Accordingly, when voltages are applied to theterminals as described above, in order to perform the shadowing process,the high positive voltage applied to terminal 72 does not cause anacceleration of electrons in order to cause hot electron injection intofloating gate/trapping layer 60, since the electrons are not flowing.Accordingly, floating gate/trapping layer 60 retains its positive chargeat the end of the shadowing process, when the volatile memory of cell 50is in state “0” (i.e., floating body 24 is neutral or negativelycharged). Note that the charge state of the floating gate/trapping layer60 is complementary to the charge state of the floating body 24 aftercompletion of the shadowing process. Thus, if the floating body 24 ofthe memory cell 50 has a positive charge in volatile memory, thefloating gate/trapping layer 60) will become negatively charged by theshadowing process, whereas if the floating body of the memory cell 50has a negative or neutral charge in volatile memory, the floatinggate/trapping layer 60 will be positively charged at the end of theshadowing operation. The charges/states of the floating gates/trappinglayers 60 are determined non-algorithmically by the states of thefloating bodies, and shadowing of multiple cells occurs in parallel,therefore the shadowing process is very fast.

In one particular non-limiting example of the shadowing processaccording to this embodiment, about +3 volts are applied to terminal 72,about 0 volts are applied to terminal 74, about +1.2 volts are appliedto terminal 70 of the selected cells, about +3.0 volts are applied toterminal 70 of the unselected cells, a voltage of about +3.0 volts isapplied to the gate of the string selection transistor 68, a voltage ofabout +3.0 volts is applied to the gate of the ground selectiontransistor 80, and about −10.0 volts are applied to terminal 76.However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about +3volts to about +6 volts, the voltage applied to terminal 74 may be inthe range of about 0.0 volts to about +0.4 volts, the voltage applied toterminal 70 of the selected cells may be in the range of about 0.0 voltsto about +1.6 volts: voltage applied to the terminals 70 of the passingcontrol gates 66 of the cells 50 not selected may be in the range ofabout +1.0 volts to about +5.0 volts, voltage applied to the gate of thestring selection transistor 68 may be in the range of about +1.0 voltsto about +5.0 volts, voltage applied to the gate of the ground selectiontransistor 80 may be in the range of about +1.0 volts to about +5.0volts, and voltage applied to terminal 76 may be in the range of about−4.0 volts to about −12.0 volts. To execute a complete shadowingoperation of a memory device including NAND strings 500, the shadowingoperations described herein with regard to NAND strings are performed“n” times.

In another embodiment to perform a restore process, terminal 72 is setto a substantially neutral voltage, a positive voltage is applied toterminal 74, a negative voltage is applied to terminal 70 of theselected cells, a positive voltage more positive than the positivevoltage applied to terminal 74 is applied to terminal 70 of theunselected cells, a positive voltage more positive than the positivevoltage applied to terminal 74 is applied to the gate of stringselection transistor 68, a positive voltage more positive than thepositive voltage applied to terminal 74 is applied to the gate of groundselection transistor 80, and a negative voltage that is more negativethan the negative voltage applied to terminal 70 is applied to terminal76. If the floating gate/trapping layer 60 of a selected cell 50 isnegatively charged, this negative charge enhances the driving force forthe band-to-band hot hole injection process, whereby holes are injectedfrom the n-region 18 into floating body 24, thereby restoring the “1”state that the volatile memory cell 50 had held prior to the performanceof the shadowing operation. If the floating gate/trapping layer 60 of aselected cell is not negatively charged, such as when the floatinggate/trapping layer 60 is positively charged or is neutral, the hotband-to-band hole injection process will not occur, resulting in memorycell 50 having a “0” state, just as it did prior to performance of theshadowing process. Accordingly, if floating gate/trapping layer 60 has apositive charge after shadowing is performed, the volatile memory offloating body 24 will be restored to have a negative charge (“0” state),but if the floating gate/trapping layer 60 has a negative or neutralcharge, the volatile memory of floating body 24 will be restored to havea positive charge (“1” state).

in one particular non-limiting example of this embodiment, about 0 voltsis applied to terminal 72, about +2 volts is applied to terminal 74,about −1.2 volts is applied to terminal 70 of the selected cells, about+3.0 volts are applied to terminal 70 of the unselected cells, a voltageof about +3.0 volts is applied to the gate of the string selectiontransistor 68, a voltage of about +3.0 volts is applied to the gate ofthe ground selection transistor 80, and about −10.0 volts are applied toterminal 76. However, these voltage levels may vary, while maintainingthe relative relationships between the charges applied, as describedabove. For example, voltage applied to terminal 72 may be in the rangeof about +1.5 volts to about +3.0 volts, voltage applied to terminal 74may be in the range of about 0.0 volts to about +0.6 volts, voltageapplied to terminal 70 of the selected cells may be in the range ofabout 0.0 volts to about −3.0 volts; voltage applied to the terminals 70of the passing control gates 66 of the cells 50 not selected may be inthe range of about +1.0 volts to about +5.0 volts, voltage applied tothe gate of the string selection transistor 68 may be in the range ofabout +1.0 volts to about +5.0 volts, voltage applied to the gate of theground selection transistor 80 may be in the range of about +1.0 voltsto about +5.0 volts, and voltage applied to terminal 76 may be in therange of about −4.0 volts to about −12.0 volts.

After restoring the memory cell(s) 50, the floating gates/trappinglayers 60 are reset to a predetermined initial state, e.g., a positivestate as illustrated in FIG. 27, so that each floating gate/trappinglayer 60 has a known state prior to performing another shadowingoperation. The reset process operates by the mechanism of electrontunneling from the floating gates/trapping layers 60 to the sourceregions 20, as illustrated in FIG. 27.

To perform a reset operation according to the embodiment of FIG. 27, asubstantially neutral voltage is applied to SL terminal 72, asubstantially neutral voltage is applied to BL terminal 74, a highlynegative voltage is applied to the terminal 70 and thus the control gate66 of the selected cell 50, a positive voltage is applied to eachterminal 70 and passing control gate of the non-selected cells, apositive voltage is applied to the gate of the ground selectiontransistor, a substantially neutral voltage is applied to the gate ofthe string selection transistor, and a negative voltage, having a lessnegative voltage than the negative voltage applied to the selected cellterminal 70, is applied to terminal 76. Under these conditions,electrons will tunnel from the selected floating gates/trapping layers60 of the selected cells 50 to the n⁺ source junction region of eachselected cell 50. As a result, the floating gates/trapping layers 60will be left in a positively charged state. The reset operation isperformed in the direction of the common source (from memory celltransistor 58 n) to the bit line (to memory cell transistor 58 a), i.e.in the direction of the arrow shown in FIG. 27. To execute a completereset operation of a memory device including NAND strings 500, the resetoperations described herein with regard to NAND strings are performed“n” times.

Alternatively, if hot holes re collected during the shadowing operation,that a high positive voltage (e.g., about +18 volts, or in the range ofabout +12 volts to about +20 volts) is applied to the terminals 70 ofthe selected cells to reset the floating gates/trapping layers 60 of theselected cells to the initial state. Under this condition, electron willtunnel into the selected floating gates/trapping layers 60 from therespective n+ junction regions, resulting in the floating gates/trappinglayers 60 becoming negatively charged.

In one particular non-limiting embodiment, as illustrated in FIG. 27,about 0 volts is applied to terminal 72, about 0 volts is applied toterminal 74, about −12.0 volts is applied to each terminal 70 of aselected cell 50, about +3V is applied to each terminal 70 (and passingcontrol gate 66) of a non-selected cell 50, about +3 volts is applied tothe gate of the ground selection transistor 80, about 0 volts is appliedto the gate of the string selection transistor, and about −10.0 volts isapplied to terminal 76.

However, these voltage levels may vary, while maintaining the relativerelationships between the charges applied, as described above. Forexample, voltage applied to terminal 72 may be in the range of about 0.0volts to about +3.0 volts, voltage applied to terminal 74 may be in therange of about 0.0 volts to about +3.0 volts, voltage applied toterminal 70 of the selected control gate 66 may be in the range of about−12.0 volts to about −20.0 volts; voltage applied to the terminals 70 ofthe passing control gates 66 of the cells 50 not selected may be in therange of about +1.0 volts to about +5.0 volts, voltage applied to thegate of the string selection transistor 68 may be in the range of about+1.0 volts to about +5.0 volts, voltage applied to the gate of theground selection transistor 80 may be in the range of about +1.0 voltsto about +5.0 volts, and voltage applied to terminal 76 may be in therange of about −4.0 volts to about −12.0 volts.

While the present invention has been described with reference to thespecific embodiments thereof, it should be understood by those skilledin the art that various changes may be made and equivalents may besubstituted without departing from the true spirit and scope of theinvention. In addition, many modifications may be made to adapt aparticular situation, material, composition of matter, process, processstep or steps, to the objective, spirit and scope of the presentinvention. All such modifications are intended to be within the scope ofthe claims appended hereto.

1-22. (canceled)
 23. A semiconductor memory device comprising a stringof memory cells connected in series, each said memory cell having: afloating body region configured to be charged to a level indicative of astate of said memory cell to store the state as volatile memory; a firstregion in electrical contact with said floating body region; a secondregion in electrical contact with said floating body region and spacedapart from said first region; a floating gate or trapping layerpositioned between said first and second regions and configured toreceive transfer of data stored as said volatile memory and store saiddata as non-volatile memory indicative of said state of the memory cell;and a control gate positioned above said floating gate or trappinglayer, wherein said charge stored in said floating body regiondetermines a charge stored in said floating gate or trapping layer uponinterruption of power to said semiconductor memory device.
 24. Thesemiconductor memory device of claim 23, wherein said floating bodyregion has a first conductivity type selected from a p-type conductivitytype and an n-type conductivity type; said first region has a secondconductivity type selected from said p-type and n-type conductivitytypes, said second conductivity type being different from said firstconductivity type; and said second region has said second conductivitytype.
 25. The semiconductor memory device of claim 23, wherein saidtransfer of data to said floating gate or trapping layer occurs in anon-algorithmic manner.
 26. The semiconductor memory device of claim 23,wherein said transfer of data to said floating gate or trapping layeroccurs upon interruption of power to said semiconductor memory device.27. The semiconductor memory device of claim 26, wherein when power isrestored to the device, data transfer from the floating gate or trappinglayer to the floating body occurs in a non-algorithmic manner, and thedevice functions as volatile memory.
 28. A semiconductor memory devicecomprising a string of memory cells connected in series, each saidmemory cell having: a floating body region configured to be charged to alevel indicative of a state of said memory cell to store the state asvolatile memory; a first region in electrical contact with said floatingbody region; a second region in electrical contact with said floatingbody region and spaced apart from said first region; a floating gate ortrapping layer positioned between said first and second regions andconfigured to receive transfer of data stored as said volatile memoryand store said data as nonvolatile memory indicative of said state ofthe memory cell; and a control gate positioned above the floating gateor trapping layer, wherein said state stored in said floating bodyregion determines a current flowing through said semiconductor memorycell.
 29. The semiconductor memory device of claim 28, wherein saidfloating body region has a first conductivity type selected from ap-type conductivity type and an n-type conductivity type; said firstregion has a second conductivity type selected from said p-type andn-type conductivity types, said second conductivity type being differentfrom said first conductivity type; and said second region has saidsecond conductivity type.
 30. The semiconductor memory device of claim28, wherein said floating gate or trapping layer receives transfer ofsaid data upon interruption of power to said semiconductor memorydevice.
 31. The semiconductor memory device of claim 28, wherein saidcurrent flowing through said semiconductor memory cell determines thecharge stored in said floating gate or trapping layer upon interruptionof power to said semiconductor memory device.
 32. The semiconductormemory device of claim 28, wherein said transfer of data to saidfloating gate or trapping layer occurs in a non-algorithmic manner. 33.The semiconductor memory device of claim 30, wherein when power isrestored to said semiconductor memory device, data transfer from saidfloating gate or trapping layer to said floating body occurs in anon-algorithmic manner, and said semiconductor memory device functionsas volatile memory.
 34. A semiconductor memory device comprising astring of memory cells connected in series, each said memory cellhaving: a floating body region; and a floating gate or trapping layerpositioned above and insulated from said floating body region; whereinsaid floating body region is configured to be charged to a levelindicative of a state of said memory cell based on charge stored in saidfloating gate or trapping layer, upon restoration of power to saidsemiconductor memory device.
 35. The semiconductor memory device ofclaim 34, wherein said memory device functions as volatile memory uponsaid restoration of power to said memory device.
 36. The semiconductormemory device of claim 34, wherein said floating body region isconfigured to a predetermined state prior to being charged based oncharge stored in said floating body or trapping layer.
 37. Thesemiconductor memory device of claim 34, wherein said floating gate ortrapping layer is configured to a predetermined state after saidfloating body region is charged to a level based on charge stored insaid floating gate or trapping layer.
 38. The semiconductor memorydevice of claim 34, further comprising a control gate positioned abovesaid floating gate or trapping layer.
 39. The semiconductor memorydevice of claim 34, further comprising a first region in electricalcontact with said floating body region and a second region spaced apartfrom said first region and in electrical contact with said floating bodyregion.